We would like to introduce you to innovative laser technologies that can significantly improve your work in the field of microelectronics. Coherent laser systems offer several key benefits that contribute to more efficient manufacturing processes, increased reliability and quality of microelectronic components.
Contact us today to discover how our laser technologies can bring innovation and improvement to your microelectronics work.
PCB Drilling
CO₂, nanosecond UV and ultrashort pulsed lasers are suitable for high-precision and high-performance drilling in circuit boards of various compositions even with the smallest hole diameters.
Powerline Avia LX / Powerline Avia NX Green / Rapid LX
Ceramic processing
You can easily and quickly cut and drill hard ceramic substrates and components using CO, CO₂, nanosecond UV DPSS and ultra-short pulsed lasers.
Diamond C/C+ / Powerline Avia NX Green / Rapid LX
Depaneling of printed circuit boards
High-energy nanosecond UV and ultra-short pulsed lasers offer unique capabilities for fast, carbon-free depaneling with minimal cut-through size, even on thick boards.
Diamond CX-10 / Powerline Avia LX / Powerline Avia NX Green / Rapid LX
Laser-assisted soldering
High-power diode lasers can irradiate large areas at precise beam intensities. Therefore, they are also suitable for fast pass-through soldering with precise heat control, which allows soldering even heat-sensitive parts.
Compact SE / Compact Evolution / Process heads and optical components
Laser marking
Easily integrated pulsed lasers that enable a wide range of laser marking tasks on organics, ceramics, metals and semiconductors, with the highest speed, excellent contrast and best-in-class software features.
Powerline E / Laser Subsystems
Optical decoupling
De-bond parts with high throughput and unmatched uptime using excimer and nanosecond lasers that effectively deactivate temporary adhesives.
