Excimer laser assembly for modification of polymers and semiconductors, laser ablation, creation of periodic structures on surfaces to enhance biocompatibility or creation of structures on semiconductor surfaces, etc.
The customer also required the ability to damp the output energy of the pulse in the range of 1-100 %, i.e. to be able to apply 1 J or 10 mJ to the sample, which is not a common feature in such a powerful excimer laser model.
Our solution
Primarily an industrial high-power excimer laser Coherent LEAP with dual attenuator for output power and pulse energy control. The output beam is guided through a covered periscope from the laser on the optical workbench to the sample using highly reflective coated mirrors.
Ultimately, the biggest challenge in the project was moving the laser, which itself weighs almost 900 kg and has a footprint of 2 x 1 m, plus it had to be moved to an above-ground floor.
Parameters of the equipment
Wavelength 248 nm
Pulse energy ≥1000 mJ @ 100Hz
Max. achievable repetition rate 100 Hz
Average power 100 W
Energy stability < 1%
Pulse length 36 ns
Beam size 32 ±3.5 x 13 ±4 mm
Beam divergence ≤4.5 x ≤1.5 mrad
Water cooled
Communication interfaces USB and Ethernet
Integrated diagnostic system
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