Replacement of CO2 laser for ceramic cutting

Commissioning of an older laser cutting machine for cutting ceramic wafers, which are further used for the production of semiconductor components.

Replacement of an obsolete non-functional CO2 laser with a current model with higher efficiency, including the implementation of control electronics ensuring communication between the machine and the new laser. The original optical path and its elements were cleaned so that it could continue to be used.

Importantly for the integration, we prepared the control electronics to ensure compatibility and communication between the machine and the new laser.

It was also important to maximize the use of the original components and subsystems to optimize the cost of integration

Equipment parameters

• 180 W max. medium power and 450 W peak power
• The laser has an integrated RF module
• The laser has a higher efficiency compared to the original laser
• The laser is liquid cooled - the original cooling circuit has been used