The PowerLine PS 30 laser subsystem brings high throughput to precision marking and micromachining. The PowerLine PS 30 laser subsystem consists of a powerful laser source based on a 30 watt picosecond laser, offers a selection of high performance scanners and an internal power meter. This allows the customer to monitor the actual output power of the laser source for high process stability and long-term consistent marking results.
Complete process control is integrated within the object-oriented Laser FrameWork operating system. With the optional fast focus module, the SmartMap3D software function simplifies marking on 3D freeform geometries: either by unfolding the surface or by directly applying it to a parallel projection of the part.
The new PowerLine PS 30 laser subsystem brings a wide range of applications to a variety of industrial applications. Its most important application is the black marking of stainless steel, titanium and other metals with high contrast at the required corrosion resistance. This black marking is ideal for the medical industry where perfect visibility and sterilization resistance is required. Another application for PowerLine PS 30 is contrast marking of difficult polymers, again most commonly used in the medical industry. PowerLine PS 30 is also suitable for cutting battery films in the electric vehicle and medical industries with high precision and minimal heat affected zone. Other applications of the PowerLine PS 30 are for micromachining and cutting of various metals with high quality and minimal surface damage. It can also handle the processing of hard materials such as tungsten carbide and PCD, allowing the marking of glass with less damage thanks to the ultra-short laser pulses.
Overall, the PowerLine PS 30 laser subsystem provides a wide range of applications for a variety of industrial applications with high quality and precision processing.
Key features
- Integration of an ultra-short pulsed laser with pulse width < 10 ps and average output power > 28 W at high pulse energies up to 250 μJ for a wide range of applications in laser marking and micromachining.
- The laser subsystem ensures easy integration, minimized development risks and short time to market by leveraging our intuitive Laser Framework control software, qualified components and optional features such as standardized vision packages
- Integrators can benefit from our application know-how, manufacturing experience and support to offer tailored solutions to customers.
